Toestel voor niet pelbare halfgeleider Ø14-44 mm

Tool that enables the user to shave the bonded semiconductor at the desired length with a chamfer on the semiconductor cutback. Stylus in option score the peelable semiconductor or chamfer the insulation.

Features

• Function: Remove the outer semi-conductor.
• Diameter: 14 - 44 mm.
• Smooth finishing over insulation.
• Fine tuning of blade with a 'click' for each 0,1 mm.
• Sliding thrust embeded in the tool to set semiconductor remaining lengt.
• Silicone required for non peelable semiconductor.
• Thickness capacity: 0,4 - 1,4 mm.
• Angle of the chamfer on the semiconductor: 14,5°.
• Remaining length: 25-30-40-45 mm.
• Certifications: Approved by ENEDIS.
• Length: 190 mm.
• Width: 85 mm.
• Height: 125 mm.
• Weight without box: 0,75 Kg.

Options

• SRC - Scoring stylus for peelable semiconductor with chamfer.
• SR - Scoring stylus for peelable semiconductor.
• SCH - Chamfering stylus for insulation.
• PCR2 - Quick set up right angled 45° handle.

Spare parts

• LASCR1 - Spare blade for bonded semiconductor.
• PER -Quick set up right angled 90° handle.