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Plastic box containing tools needed to prepare cables.

Content

  • PG3C28L33: Pliers for MV cable outer sheath.
  • MF1+: Tool for bonded semiconductor.
  • MF2/40: Multifunction tool for outer sheath and insulation.
  • LMF2: Blade for outer sheath and primary insulation.
  • GRB-FINIT: Scraper for residues of bonded semiconductor screen Ø15 - 240 mm.
  • OGA: Outer sheath opener tool.
  • PASC1: Gauge for pre-setting the blade of the tools to remove the bonded semiconductor.
  • ASC/R2: tool to remove the bonded semi-conductor.
  • RTT2: Tool for sheath abrading.

PG3C28L33

  • It enables the user to make a circular and longitudinal cut in order to remove cable's outer sheath.
  • Diameter: 26 - 52 mm.
  • Circular cutting depth: 2,8 mm.
  • Longitudinal cutting depth: 3,3 mm.
  • Application: field, laboratory, production.
  • Product benefits : Quick, light and easy to use.
  • Length: 265 mm.
  • Width: 95 mm.
  • Height: 80 mm.
  • Weight without box: 0,6 Kg.

MF1+

  • Function: Remove the outer semi-conductor.
  • Diameter: 14 - 44 mm.
  • Smooth finishing over insulation.
  • Fine tuning of blade with a 'click' for each 0,1 mm.
  • Sliding thrust embeded in the tool to set semiconductor remaining lengt.
  • Silicone required for non peelable semiconductor.
  • Thickness capacity: 0,4 - 1,4 mm.
  • Angle of the chamfer on the semiconductor: 14,5°.
  • Remaining length: 25-30-40-45 mm.
  • Certifications: Approved by ENEDIS.
  • Length: 190 mm.
  • Width: 85 mm.
  • Height: 125 mm.
  • Weight without box: 0,75 Kg.

MF2/40

  • Enables the user to remove the outer sheath (PE-PVC-PR) with a straight and neat cut.
  • Enables the user to set the length and remove thicker insulation with a straight and neat cut.
  • Capacity: ø16 - 40 mm.
  • Tuning of the pitch of the tool.
  • Embeded wear pads to protect the tool from the contact with the outer sheath.
  • Outer sheath and insulation thickness capacity: 7 mm.
  • Certifications: Approved by ENEDIS.
  • Length: 150 mm.
  • Width: 80 mm.
  • Height: 100 mm.
  • Weight without box: 1,24 Kg.

LMF2

  • To remove the outer sheath and the insulation.
  • Capacity: ø14 - 58 mm.
  • The blade LMF2 fits the following products: MF2/40, MF2/60, MF3/40, MF3/60, MF3/40-SSR, MF3/60-SSR, MF3NP/40, MF3NP/60, BRMRD1E.
  • Cutting depth: 9 mm.
  • Certifications: Approved by ENEDIS.
  • Length: 36 mm.
  • Width: 16 mm.
  • Height: 6 mm.
  • Weight without box: 0,007 Kg.

OGA

  • Function: It enables the user to perform a longitudinal cut on the outer sheath of the cables.
  • Diameter: 20 - 200 mm.
  • 2 cutting edges on the same blade for an extended working life.
  • 4 cutting thickness positions.
  • Hevy duty.
  • Length: 180 mm.
  • Width: 26 mm.
  • Height: 62 mm.
  • Weight without box: 0,27 Kg.
  • Spare blade: LKMS.

ASC/R2

  • ASC R2 tool removes the bonded semi-conductor from MV and HV cables and chamfers the semi-conductor in a clean and swift manner.
  • The blade is adjustable from 0.4 to 1.4 mm.
  • Remaining length of semi-conductor: 30 or 40 mm without adjustment.
  • Diameter on semi-conductor: 20 to 50 mm.
  • Sections: 50 to 630 mm².
  • Length: 180 mm.
  • Width: 55 mm.
  • Height: 105 mm.
  • Weight: 780 g.

RTT2

  • Function : Circular abrasion of the outer sheath of the cable.
  • Diamètre : 20 - 52 mm.
  • Longueur : 277 mm.
  • Largeur : 87 mm.
  • Hauteur : 71 mm.
  • Poids hors coffret : 0,91 Kg.
Toon meer
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Contacteer ons via e-mail op infocontact@sadinter.be of telefonisch op 02/349.09.11.

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Momenteel zijn er geen online aankopen mogelijk.
Toch kopen of op zoek naar een offerte?
Contacteer ons via e-mail op infocontact@sadinter.be of telefonisch op 02/349.09.11.

Omschrijving

Plastic box containing tools needed to prepare cables.

Content

  • PG3C28L33: Pliers for MV cable outer sheath.
  • MF1+: Tool for bonded semiconductor.
  • MF2/40: Multifunction tool for outer sheath and insulation.
  • LMF2: Blade for outer sheath and primary insulation.
  • GRB-FINIT: Scraper for residues of bonded semiconductor screen Ø15 - 240 mm.
  • OGA: Outer sheath opener tool.
  • PASC1: Gauge for pre-setting the blade of the tools to remove the bonded semiconductor.
  • ASC/R2: tool to remove the bonded semi-conductor.
  • RTT2: Tool for sheath abrading.

PG3C28L33

  • It enables the user to make a circular and longitudinal cut in order to remove cable's outer sheath.
  • Diameter: 26 - 52 mm.
  • Circular cutting depth: 2,8 mm.
  • Longitudinal cutting depth: 3,3 mm.
  • Application: field, laboratory, production.
  • Product benefits : Quick, light and easy to use.
  • Length: 265 mm.
  • Width: 95 mm.
  • Height: 80 mm.
  • Weight without box: 0,6 Kg.

MF1+

  • Function: Remove the outer semi-conductor.
  • Diameter: 14 - 44 mm.
  • Smooth finishing over insulation.
  • Fine tuning of blade with a 'click' for each 0,1 mm.
  • Sliding thrust embeded in the tool to set semiconductor remaining lengt.
  • Silicone required for non peelable semiconductor.
  • Thickness capacity: 0,4 - 1,4 mm.
  • Angle of the chamfer on the semiconductor: 14,5°.
  • Remaining length: 25-30-40-45 mm.
  • Certifications: Approved by ENEDIS.
  • Length: 190 mm.
  • Width: 85 mm.
  • Height: 125 mm.
  • Weight without box: 0,75 Kg.

MF2/40

  • Enables the user to remove the outer sheath (PE-PVC-PR) with a straight and neat cut.
  • Enables the user to set the length and remove thicker insulation with a straight and neat cut.
  • Capacity: ø16 - 40 mm.
  • Tuning of the pitch of the tool.
  • Embeded wear pads to protect the tool from the contact with the outer sheath.
  • Outer sheath and insulation thickness capacity: 7 mm.
  • Certifications: Approved by ENEDIS.
  • Length: 150 mm.
  • Width: 80 mm.
  • Height: 100 mm.
  • Weight without box: 1,24 Kg.

LMF2

  • To remove the outer sheath and the insulation.
  • Capacity: ø14 - 58 mm.
  • The blade LMF2 fits the following products: MF2/40, MF2/60, MF3/40, MF3/60, MF3/40-SSR, MF3/60-SSR, MF3NP/40, MF3NP/60, BRMRD1E.
  • Cutting depth: 9 mm.
  • Certifications: Approved by ENEDIS.
  • Length: 36 mm.
  • Width: 16 mm.
  • Height: 6 mm.
  • Weight without box: 0,007 Kg.

OGA

  • Function: It enables the user to perform a longitudinal cut on the outer sheath of the cables.
  • Diameter: 20 - 200 mm.
  • 2 cutting edges on the same blade for an extended working life.
  • 4 cutting thickness positions.
  • Hevy duty.
  • Length: 180 mm.
  • Width: 26 mm.
  • Height: 62 mm.
  • Weight without box: 0,27 Kg.
  • Spare blade: LKMS.

ASC/R2

  • ASC R2 tool removes the bonded semi-conductor from MV and HV cables and chamfers the semi-conductor in a clean and swift manner.
  • The blade is adjustable from 0.4 to 1.4 mm.
  • Remaining length of semi-conductor: 30 or 40 mm without adjustment.
  • Diameter on semi-conductor: 20 to 50 mm.
  • Sections: 50 to 630 mm².
  • Length: 180 mm.
  • Width: 55 mm.
  • Height: 105 mm.
  • Weight: 780 g.

RTT2

  • Function : Circular abrasion of the outer sheath of the cable.
  • Diamètre : 20 - 52 mm.
  • Longueur : 277 mm.
  • Largeur : 87 mm.
  • Hauteur : 71 mm.
  • Poids hors coffret : 0,91 Kg.