Toestel voor niet pelbare halfgeleider Ø14-44 mm

BSC/25-40 tool removes the bonded semi-conductor from MV and HV cables and chamfers the semiconductor in a clean and swift manner.

Features

• Removal of the bonded semiconductor.
• The blade is adjustable from 0.4mm to 1.5 mm.
• Capacity: diameter on semiconductor: 14mm to 44 mm.
• Dimensions: 155 x 82 x 65 mm.
• Weight: 620 g.